/ DC Magnetron Sputtering /

DC Magnetron Sputtering：

DC magnetron sputtering is an enhanced version of DC sputtering. The basic principle remains the same, but a magnetic field is added near the target surface. The magnetic field traps electrons close to the target, causing them to move in a spiral path. This increases the collision frequency between electrons and gas atoms, thereby generating more ions and increasing the number of high-energy ions striking the target.

Advantages：

• Significantly higher deposition efficiency

Disadvantages：

• Faster target consumption