/ DC Sputtering /

DC Sputtering：

DC sputtering is a commonly used thin-film deposition technique performed inside a vacuum chamber. When a high voltage is applied, the working gas (typically argon) becomes ionized, generating a large number of high-energy ions. These ions accelerate toward the target material, which acts as the cathode, knocking atoms off its surface. The ejected atoms then deposit onto the substrate, forming a thin film.

Common Gas：

• Argon (Ar): An inert, low-cost gas with atomic mass close to typical target materials; does not react with the target.

Advantages：

• High deposition efficiency
• Relatively low cost

Disadvantages：

• Applicable only to conductive target materials
• Non-conductive targets accumulate charge, reducing deposition rate